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Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions

Article scientifique 2019 Anglais

Résumé

Passivation is a key process for the optimization of silicon p-n junctions. Among the different technologies used to passivate the surface and contact interfaces, alumina is widely used. One key parameter is the thickness of the passivation layer that is commonly deposited using atomic layer deposition (ALD) technique. This paper aims at presenting correlated structural/electrical studies for the passivation effect of alumina on Si junctions to obtain optimal thickness of alumina passivation layer. High-resolution transmission electron microscope (HRTEM) observations coupled with energy dispersive X-ray (EDX) measurements are used to determine the thickness of alumina at atomic scale. The correlated electrical parameters are measured with both solar simulator and Sinton's Suns-Voc measurements. Finally, an optimum alumina thickness of 1.2 nm is thus evidenced.

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Liu, K., Cristini, O., Elmi, O., Wang, S., Wei, B., Yu, I., Portier, X., Gourbilleau, F., Stiévenard, D., Xu, T. (2019). Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions. https://doi.org/10.1186/s11671-019-3160-2

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Auteur(s)

Kangping Liu O. Cristini Omar Ibrahim Elmi Shuanglong Wang Bin Wei Ing‐Song Yu X. Portier F. Gourbilleau Didier Stiévenard Tao Xu

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